Dissolved wafer process using a porous silicon sacrificial layer and a lightly-doped bulk silicon etch-stop

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1998, Pages 251-256

  Bell, T E ^a   Wise, K D ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; ELECTRODES; EPITAXIAL GROWTH; MICROMACHINING; POROUS SILICON; POTASSIUM COMPOUNDS; PROBES; PROSTHETICS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DOPING; SUBSTRATES;

NEURAL PROBES; POTASSIUM HYDROXIDE;

SILICON WAFERS;

EID: 0031654019     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)