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Volumn 50, Issue 10, 2002, Pages 2627-2637

Stable dielectric fracture at interconnects from electromigration stresses

Author keywords

Electromigration; Fracture; Mechanical properties; Modeling; Theory; Thin films

Indexed keywords

DIELECTRIC FRACTURE;

EID: 0037067201     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(02)00092-7     Document Type: Article
Times cited : (6)

References (11)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.