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Volumn 50, Issue 10, 2002, Pages 2627-2637
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Stable dielectric fracture at interconnects from electromigration stresses
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Author keywords
Electromigration; Fracture; Mechanical properties; Modeling; Theory; Thin films
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Indexed keywords
DIELECTRIC FRACTURE;
CRACKS;
ELECTROMIGRATION;
FRACTURE;
STRESS ANALYSIS;
THIN FILMS;
DIELECTRIC MATERIALS;
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EID: 0037067201
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/S1359-6454(02)00092-7 Document Type: Article |
Times cited : (6)
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References (11)
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