Optimization of CMP from the viewpoint of consumable effects

Journal of the Electrochemical Society

Volumn 150, Issue 12, 2003, Pages

  Luo, Jianfeng ^a   Dornfeld, David A ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; INTEGRATED CIRCUIT MANUFACTURE; OPTIMIZATION; VLSI CIRCUITS;

ABRASIVE SIZE DISTRIBUTION; CHEMICAL MECHANICAL PLANARIZATION;

ELECTROCHEMISTRY;

EID: 0347051558     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1623771     Document Type: Article

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