Filling algorithms and analyses for layout density control

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Volumn 18, Issue 4, 1999, Pages 445-462

  Kahng, Andrew B ^a,b   Robins, Gabriel ^a,b   Singh, Anish ^a,b   Zelikovsky, Alexander ^a,b  

^a University of California   (United States)

^b University of Virginia   (United States)

Author keywords

Chemical mechanical polishing (cmp); Density control; Layout verification; Manufacturability; Metal fill; Physical design; Yield enhancement

Indexed keywords

EID: 0001130989     PISSN: 02780070     EISSN: None     Source Type: Journal    
DOI: 10.1109/43.752928     Document Type: Article

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