Flexible system for multiple plasma immersion ion implantation-deposition processes

Review of Scientific Instruments

Volumn 74, Issue 12, 2003, Pages 5137-5140

  Tian, Xiubo ^a,c   Fu, Ricky K Y ^a   Chu, Paul K ^a   Anders, Andre ^b   Gong, Chunzhi ^c   Yang, Shiqin ^c  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b UNIVERSITY OF CALIFORNIA   (United States)

^c HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

MULTIPLE PLASMA IMMERSION ION IMPLANTATION DEPOSITION; PLASMA TRANSFER;

ELECTRIC ARCS; ELECTRIC CURRENTS; MORPHOLOGY; PHASE SHIFT; PLASMA APPLICATIONS; PLASMA DENSITY; TITANIUM NITRIDE;

ION BEAM ASSISTED DEPOSITION;

EID: 0346936161     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1626012     Document Type: Article

References (24)

1. J. R. Conrad, J. I. Radke, R. A. Dodd, F. J. Warzala, and N. C. Tran, J. Appl. Phys. 62, 4591 (1987).
2. I. G. Brown, X. Oodechot, and K. M. Yu, Appl. Phys. Lett. 58, 1392 (1991).
3. A. Anders, Surf. Coat. Technol. 93, 158 (1997).
4. I. G. Brown, A. Anders, S. Anders, M. R. Dickinson, I. C. Ivanov, R. A. MacGill, X. Y. Yao, and K. M. Yu, Nucl. Instrum. Methods Phys. Res. B 80/81, 1281 (1993).
5. D. Manova, P. Huber, S. Mandl, and B. Rauschenbach, Surf. Coat. Technol. 142, 61 (2001).
6. S. Mandl, G. Thorwarth, D. Manova, and B. Rauschenbach, Nucl. Instrum. Methods Phys. Res. B 178, 148 (2001).
7. M. Sano, T. Teramoto, K. Yukimura, and T. Maruyama, Surf. Coat. Technol. 136, 168 (2001).
8. J. M. Schneider, A. Anders, B. Hjörvarsson, and L. Hultman, Appl. Phys. Lett. 76, 1531 (2000).
9. K. Yukimura, K. Yoshioka, and Y. Tani, Rev. Sci. Instrum. 71, 1184 (2000).
10. M. M. M. Belik, P. J. Martin, and D. R. McKenzie, J. Appl. Phys. 83, 2965 (1998).
11. S. Anders and B. Juttner, IEEE Trans. Plasma Sci. 19, 705 (1991).
12. V. N. Zhitomirsky, U. Kinrot, B. Alterkop, R. L. Boxman, and S. Goldsmith, Surf. Coat. Technol. 87/88, 263 (1996).
13. X. B. Tian, T. Zhang, Z. M. Zeng, B. Y. Tang, and P. K. Chu, J. Vac. Sci. Technol. A 17, 3255 (1999).
14. P. K. Chu, B. Y. Tang, Y. C. Cheng, and P. K. Ko, Rev. Sci. Instrum. 68, 1866 (1997).
15. T. Hayashi, A. Matsumuro, M. Muramatsu, Y. Takahashi, and K. Yamaguchi, Thin Solid Films 349, 199 (1999).
16. L. P. Wang, K. Y. Fu, X. B. Tian, B. Y. Tang, and P. K. Chu, Mater. Sci. Eng. A 336, 75 (2002).
17. K. Volz, M. Kiuchi, M. Okumura, and W. Ensinger, Surf. Coat. Technol. 128, 274 (2000).
18. R. Hubler, Surf. Coat. Technol. 119, 1116 (1999).
19. X. M. He, W. Z. Li, and H. D. Li, Surf. Coat. Technol. 84, 414 (1996).
20. A. Anders, Phys. Rev. E 55, 969 (1997).
21. A. Anders, S. Anders, I. G. Brown, and K. M. Yu, Nucl. Instrum. Methods Phys. Res. B 102, 132 (1995).
22. X. B. Tian, S. C. H. Kwok, L. P. Wang, and P. K. Chu, Mater. Sci. Eng. A 326, 348 (2002).
23. A. Anders, S. Anders, I. G. Brown, M. R. Dickinson, and R. A. MacGill, J. Vac. Sci. Technol. B 12, 815 (1994).
24. X. B. Tian, T. Zhang, R. K. Y. Fu, and P. K. Chu, Surf. Coat. Technol. 161, 232 (2002).