A study of electromigration in 3D flip chip solder joint using numerical simulation of heat flux and current density

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 558-563

  Lee, Tien Yu Tom ^a   Lee, Taek Yeong ^b   Tu, King Ning ^b  

^a MOTOROLA INC   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; COPPER; CURRENT DENSITY; FLIP CHIP DEVICES; HEAT CONDUCTION; HEAT FLUX; NICKEL; SOLDERED JOINTS; THERMAL CONDUCTIVITY; THERMOANALYSIS;

CURRENT DENSITY DISTRIBUTION; THREE DIMENSIONAL FLIP CHIP JOINT; THREE DIMENSIONAL HEAT CONDUCTION ANALYSIS;

ELECTROMIGRATION;

EID: 0034835758     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2001.927783     Document Type: Article

References (6)

1. Electromigration studies of flip chip bump solder joints
2. Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes
3. Electromigration of eutectic SnPb solder interconnects for flip chip technology