A new type of dislocation mechanism in ultrathin copper films

Materials Research Society Symposium - Proceedings

Volumn 695, Issue , 2002, Pages 53-58

  Balk, T John ^a   Dehm, Gerhard ^a   Arzt, Eduard ^a  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRYSTAL MICROSTRUCTURE; DISLOCATIONS (CRYSTALS); PLASTIC DEFORMATION; PLASTICITY; SILICON WAFERS; STRESSES; SUBSTRATES; THERMAL CYCLING; THERMOMECHANICAL TREATMENT; THICKNESS MEASUREMENT; TRANSMISSION ELECTRON MICROSCOPY;

ULTRATHIN COPPER FILMS; WAFER CURVATURE;

ULTRATHIN FILMS;

EID: 0036353672     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)