Intrinsic strain modeling and residual stress analysis for thin-film processing of layered structures

Journal of Electronic Packaging

Volumn 125, Issue 1, 2003, Pages 4-17

  Ghasemi Nejhad, Mehrdad N ^a   Pan, Chiling ^a   Feng, Hongwei ^a  

^a University of Hawaii at Manoa   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL STRUCTURE; FINITE ELEMENT METHOD; MICROELECTROMECHANICAL DEVICES; RESIDUAL STRESSES; STRAIN; TEMPERATURE; THERMAL EXPANSION;

EQUIVALENT REFERENCE TEMPERATURE; LAYERED STRUCTURES; PIEZOELECTRIC MICROELECTROMECHANICAL SYSTEMS; THIN FILM PROCESSING;

THIN FILMS;

EID: 0344119466     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1512295     Document Type: Article

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