Residual thermo-mechanical stresses in ultra thin chip stack technology

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4019, Issue , 2000, Pages 315-323

  Puigcorbe, J ^a   Leseduarte, S ^a   Marco, S ^a   Beyne, E ^a   Van Hoof, R ^a   Marty, A ^a   Pinel, S ^a   Vendier, O ^a   Coello Vera, A ^a  

^a UNIVERSITY OF BARCELONA   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

BUTENES; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; LIGHT SENSITIVE MATERIALS; MATHEMATICAL MODELS; MULTICHIP MODULES; OPTIMIZATION; RESIDUAL STRESSES; STRESS ANALYSIS; THERMAL STRESS;

BENZOCYCLOBUTENE (BCB); ULTRATHIN CHIP STACK (UTCS) TECHNOLOGY;

MICROPROCESSOR CHIPS;

EID: 0033688416     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)