Cost-effective RF front-end module using high Q passive components on liquid crystal polymer substrates and micro-BGA

IEICE Transactions on Electronics

Volumn E86-C, Issue 8, 2003, Pages 1584-1592

  Pinel, Stéphane ^a   Davis, Mekita F ^a   Sundaram, Venky ^a   Lim, Kyutae ^a   Laskar, Joy ^a   White, George ^a   Tummala, Rao R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Inductors; LCP; Microwave module; BGA

Indexed keywords

ELECTRIC INDUCTORS; LIQUID CRYSTAL POLYMERS; LOCAL AREA NETWORKS; WIRELESS TELECOMMUNICATION SYSTEMS;

MICRO BALL GRID ARRAY; SYSTEM-ON-CHIP; SYSTEM-ON-PACKAGE;

ELECTRONICS PACKAGING;

EID: 0142118275     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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