RF electrical measurements of fine pitch BGA packages

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 2, 2001, Pages 233-239

  Caggiano, Michael F ^a   Ou, Jack ^a   Bulumulla, Selaka ^b   Lischner, David ^b  

^a RUTGERS UNIVERSITY   (United States)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

Calibration fixture; Fine pitch BGA; Network analyzer; RF measurements; Test fixture

Indexed keywords

CELLULAR TELEPHONE SYSTEMS; ELECTRIC NETWORK ANALYZERS; ELECTRIC VARIABLES MEASUREMENT; ELECTRONICS PACKAGING; INSERTION LOSSES;

FINE PITCH BALL GRID ARRAYS (FPBGA);

FIXTURES (TOOLING);

EID: 0035365615     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.926388     Document Type: Article

References (9)

1. RF electrical measurements comparisons of a 64 TQFP with a computer generated model
2. Comparison of advanced measurement and modeling techniques for electrical characterization of ball grid array packages
3. Electrical characterization of BGA packages