Design and performance of a high density 3D microwave module

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 1997, Pages 501-504

  Sturdivant, Rick ^a   Ly, Chung ^a   Benson, Joe ^a   Hauhe, Mark ^a  

^a RAYTHEON COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; METALLIZING; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SUBSTRATES;

PACKAGING CONFIGURATIONS; THREE DIMENSIONAL MICROWAVE MODULE;

ELECTRONICS PACKAGING;

EID: 0030646941     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)