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IEEE MTT-S International Microwave Symposium Digest

Volumn 1, Issue , 2001, Pages 1739-1742

A highly integrated transceiver module for 5.8 GHz OFDM communication system using multi-layer packaging technology

(8) Lim, Kyutae a Obatoyinbo, Ade a Sutono, Albert a Chakraborty, Sudipto a Lee, Chang Ho a Gebara, Edward a Raghavan, Arvind a Laskar, Joy a

a GEORGIA INSTITUTE OF TECHNOLOGY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); COMPUTER SIMULATION; ELECTRIC FILTERS; MIXER CIRCUITS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; MULTILAYERS; SEMICONDUCTING GALLIUM ARSENIDE; TRANSCEIVERS; VARIABLE FREQUENCY OSCILLATORS;

LOW TEMPERATURE COFIRED CERAMICS; MULTI LAYER PACKAGING;

ELECTRONICS PACKAGING;

EID: 0035689597 PISSN: 0149645X EISSN: None Source Type: Journal
DOI: 10.1109/MWSYM.2001.967242 Document Type: Article

Times cited : (45)

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