Single-package integration of RF blocks for a 5 GHz WLAN application

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 3, 2001, Pages 384-391

  Diels, Wim ^a,b   Vaesen, Kristof ^a,b   Wambacq, Piet ^a,b   Donnay, Stéphane ^a,b   De Raedt, Walter ^a,b   Engels, Marc ^a,b   Bolsens, Ivo ^a,b  

^a IEEE   (Belgium)

^b IMEC   (Belgium)

Author keywords

Bandpass filter; Downconverter; Low noise amplifier; MCM; RF front end; Single package integration; System in a package; Transceiver; Wireless LAN

Indexed keywords

LOW NOISE AMPLIFIER; RADIOFREQUENCY BLOCKS; SINGLE PACKAGE INTEGRATION; SYSTEM-IN-A-PACKAGE; WIRELESS LOCAL AREA NETWORKS;

BANDPASS FILTERS; CELLULAR RADIO SYSTEMS; CMOS INTEGRATED CIRCUITS; CROSSTALK; IMPEDANCE MATCHING (ELECTRIC); INTEGRATED CIRCUIT MANUFACTURE; LOCAL AREA NETWORKS; MULTICHIP MODULES; POWER AMPLIFIERS; SPURIOUS SIGNAL NOISE; TRANSCEIVERS; WIRELESS TELECOMMUNICATION SYSTEMS;

ELECTRONICS PACKAGING;

EID: 0035421278     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.938307     Document Type: Article

References (21)

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