Development of a 36GHz millimeter-wave BGA package

IEEE MTT-S International Microwave Symposium Digest

Volumn 1, Issue , 2000, Pages 65-68

  Liang, Hongwei ^a   Laskar, Joy ^a   Hyslop, Mike ^a   Panicker, Ram ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAY PACKAGES; MONOLITHIC MICROWAVE INTEGRATED CIRCUIT AMPLIFIER;

COST EFFECTIVENESS; ELECTRONICS PACKAGING; HIGH ELECTRON MOBILITY TRANSISTORS; INSERTION LOSSES; INTEGRATED CIRCUIT LAYOUT; MICROSTRIP LINES; MICROWAVE AMPLIFIERS; OPTIMIZATION; PRINTED CIRCUIT BOARDS;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0033678412     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)

1. R. Ito, R.W. Jackson, T. Hongsmatip, "Modeling of Interconnections and Isolation Within a Multilayered Ball Grid Array Package", IEEE Trans. on Microwave Theory and Techniques, Vo1.47, No.9, pp.1819-1825, Sept. 1999
2. D. Staiculescu, A. Pham, J. Laskar, S. Consolazio, and S. Moghe, "Analysis and Performance of BGA Interwnnects for RF Packaging", IEEE RFIC Symposium Digest, pp.131-134, June 1998
3. T. Budka, L. Stiborek, L. Heinrich, and C. Kyhl, "An Embedded Transmission Line Micro-Ball Grid Array X-Band Amplifier", IEEE International Microwave Symposium Digest, pp.1293-1296, June 1998
4. T. Krems, W.H. Haydl, H. Massler, and J. Rudiger, "Advantages of Flip Chip Technology in Millimeter-WavePackaging", IEEE International Microwave Symposium Digest, pp.987-990, June 1997
5. M.P.R. Panicker, D. Douriet, M.S. Hyslop, and N.L. Greenman, "Ball Grid Arrays: A DC to 3 1.5 GHz Low Cost Packaging Solution for Microwave and "-Wave MMICs", Microwave Journal, Vo1.41, No. 1, pp. 158-1 68, Jan. 1998.
6. Hewlett-Packard Product Note 8510, "Applying the HP8510 TRL Calibration for non-waxial measurements".
7. H. Liang, J. Laskar, M. Hyslop, R. Panicker, "A Novel De-Embedding Technique for Millimeter-Wave Package Characterization", 5dh ARF'TG Digest, Atlanta, GA, pp.137-144, Dec. 1999
8. Hewlett Packard 85150B, Microwave and Design Systems
9. Y. Arai, M. Sato, H.T. Yamada, T. Hamada, K. Nagai H.I. Fujishiro, "6OGHz Flip-Chip Assembled MIC Design Considering Chip-Substrate Effect", IEEE International Microwave Symposium Digest, pp.447-450, June, 1997