Variable frequency microwave processing of underfill encapsulants for flip-chip applications

Journal of Electronic Packaging

Volumn 125, Issue 2 SPEC., 2003, Pages 302-307

  Mead, Patricia F ^a   Ramamoorthy, Aravind ^a   Pal, Shapna ^a   Fathi, Z ^b   Ahmad, I ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b Lambda Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DELAMINATION; ELASTIC MODULI; ENCAPSULATION; FLIP CHIP DEVICES; GLASS TRANSITION; INDUSTRIAL OVENS; MICROWAVES; SEMICONDUCTING POLYMERS; SUBSTRATES; TEMPERATURE; THERMAL EXPANSION;

CONVECTION OVEN; UNDERFILL ENCAPSULANTS; VARIABLE FREQUENCY MICROWAVE;

INTEGRATED CIRCUIT TESTING;

EID: 0141718530     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1571077     Document Type: Article

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