Investigation of variable frequency microwave processing for electronic packaging applications

Journal of Electronic Packaging

Volumn 125, Issue 2 SPEC., 2003, Pages 294-301

  Mead, Patricia F ^a   Ramamoorthy, Aravind ^a   Pal, Shapna ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; ENCAPSULATION; FAILURE ANALYSIS; FLIP CHIP DEVICES; HEAT CONVECTION; INTEGRATED CIRCUIT MANUFACTURE; MICROWAVES; RELIABILITY; STRESSES; THERMAL CYCLING;

POLYMERIC ENCAPSULANTS; TEMPERATURE CYCLES; VARIABLE FREQUENCY MICROWAVE;

ELECTRONICS PACKAGING;

EID: 0141718534     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1571076     Document Type: Article

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