Investigation of variable frequency microwaves for cure of flip chip underfills

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Ramamoorthy, Aravind ^a   Mead, Patricia F ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; FAILURE ANALYSIS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MICROWAVES; SEMICONDUCTOR DEVICE MODELS;

DIRECT CHIP ATTACH (DCA); FLIP CHIP UNDERFILLS; VARIABLE FREQUENCY MICROWAVES (VFM);

ELECTRONICS PACKAGING;

EID: 0343167460     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Andersen, B., Ahmad, I., Tucker, D., Goldstein, S., Fathi, Z., Ramamoorthy, A., Pal, S., Mead, P., "Rapid Processing and Properties Evaluation of Flip-Chip Underfills", Presented at the NEPCON West Conference, Anaheim, March 1998.
2. Ramamoorthy, A., Mead, P., Pal, S., Ahmad, I., Tucker, D., Fathi, Z., "Variable Frequency Microwave Processing of Flip Chip Underfills", Presented at the IMAPS 2nd International Advanced Technology Workshop on Low Cost Flip Chip Technology, Braselton, Georgia, March 1998.
3. Troutman, R., "Latchup in CMOS Technology the problem and its cure" Kluwer Academic Publishers, 1986.
4. Lau, J., "Flip chip Technologies", McGraw Hill, 1996.