Comparison of die level stresses in chip-on-board packages processed with convection and variable frequency microwave encapsulant curing

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3830, Issue , 1999, Pages 7-16

  Zou, Yida ^a   Wayne Johnson, R ^a   Suhling, Jeffrey C ^a   Jaeger, Richard C ^a   Harris, Joe ^a   Kromis, Cheryl ^a   Ahmad, Iftikhar ^a   Tucker, Denise ^a   Fathi, Zak ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DELAMINATION; ELECTRONICS PACKAGING; HEAT CONVECTION; INTERFACES (MATERIALS); MATERIALS TESTING; MECHANICAL VARIABLES MEASUREMENT; RELIABILITY; SEMICONDUCTOR DEVICES; THERMAL CYCLING;

CHIP ON BOARD PACKAGE; DIE LEVEL STRESS; ENCAPSULANT; SEMICONDUCTOR DIE; VARIABLE FREQUENCY MICROWAVE CURING; WARPAGE;

ENCAPSULATION;

EID: 0033366575     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)