Hardmask technology for sub-100 nm lithographic imaging

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5039 I, Issue , 2003, Pages 152-165

  Babich, Katherina ^a   Mahorowala, Arpan P ^a   Medeiros, David R ^a   Pfeiffer, Dirk ^a   Petrillo, Karen ^a   Angelopoulos, Marie ^a   Grill, Alfred ^a   Patel, Vishnubhai V ^a   Halle, Scott ^b   Brunner, Timothy A ^b   Conti, Richard ^b   Allen, Scott ^b   Wise, Richard ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

Author keywords

Adhesion failure; Antireflective coatings; Combined ARC hardmask materials; Hardmasks; High resolution lithography; Image collapse; Index graded ARCs; Optical constants; PECVD ARCs; Thin resist process

Indexed keywords

ANTIREFLECTION COATINGS; FLUOROCARBONS; OPTICAL PROPERTIES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMA ETCHING; SILICA;

BOTTOM ANTIREFLECTIVE COATINGS; DIELECTRIC STACKS; HARDMASKS; IMAGE COLLAPSE; OPTICAL CONSTANTS; THIN RESIST PROCESS;

PHOTORESISTS;

EID: 0141611796     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.485174     Document Type: Conference Paper

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