-
1
-
-
0035691659
-
A new 4H-SiC lateral merged double schottky (LMDS) rectifier with excellent forward and reverse characteristics
-
Dec.
-
Y. Singh and M. J. Kumar, "A new 4H-SiC lateral merged double schottky (LMDS) rectifier with excellent forward and reverse characteristics," IEEE Trans. Electron Devices, vol. 48, pp. 2695-2700, Dec. 2001.
-
(2001)
IEEE Trans. Electron Devices
, vol.48
, pp. 2695-2700
-
-
Singh, Y.1
Kumar, M.J.2
-
2
-
-
0032121583
-
Design considerations and experimental analysis of high-voltage SiC schottky barrier rectifiers
-
Aug.
-
K. J. Schoen, J. M. Woodall, J. A. Cooper Jr., and M. R. Melloch, "Design considerations and experimental analysis of high-voltage SiC schottky barrier rectifiers," IEEE Trans. Electron Devices, vol. 45, pp. 1595-1603, Aug. 1998.
-
(1998)
IEEE Trans. Electron Devices
, vol.45
, pp. 1595-1603
-
-
Schoen, K.J.1
Woodall, J.M.2
Cooper J.A., Jr.3
Melloch, M.R.4
-
3
-
-
0035361730
-
Novel lateral merged double schottky (LMDS) rectifier: Proposal and design
-
June
-
Y. Singh and M. J. Kumar, "Novel lateral merged double schottky (LMDS) rectifier: Proposal and design," in IEE Proc. Circuits. Devices Syst., vol. 148, June 2001, pp. 165-170.
-
(2001)
IEE Proc. Circuits. Devices Syst.
, vol.148
, pp. 165-170
-
-
Singh, Y.1
Kumar, M.J.2
-
4
-
-
0036252348
-
Lateral thin-film schottky (LTFS) rectifier on SOI: A device with higher than plane parallel breakdown voltage
-
Jan.
-
_, "Lateral thin-film schottky (LTFS) rectifier on SOI: A device with higher than plane parallel breakdown voltage," IEEE Trans. Electron Devices, vol. 49, pp. 181-184, Jan. 2002.
-
(2002)
IEEE Trans. Electron Devices
, vol.49
, pp. 181-184
-
-
-
5
-
-
0036638025
-
A new low-loss lateral trench sidewall schottky (LTSS) rectifier on SOI with high and sharp breakdown voltage
-
July
-
M. J. Kumar and Y. Singh, "A new low-loss lateral trench sidewall schottky (LTSS) rectifier on SOI with high and sharp breakdown voltage," IEEE Trans. Electron Devices, vol. 49, pp. 1316-1319, July 2002.
-
(2002)
IEEE Trans. Electron Devices
, vol.49
, pp. 1316-1319
-
-
Kumar, M.J.1
Singh, Y.2
-
7
-
-
0033097465
-
High-voltage Ni- and Pt-SiC schottky diodes utilizing metal field plate termination
-
Mar.
-
V. Saxena, J. N. Su, and A. J. Steckl, "High-voltage Ni- and Pt-SiC schottky diodes utilizing metal field plate termination," IEEE Trans. Electron Devices, vol. 46, pp. 456-464, Mar. 1999.
-
(1999)
IEEE Trans. Electron Devices
, vol.46
, pp. 456-464
-
-
Saxena, V.1
Su, J.N.2
Steckl, A.J.3
-
8
-
-
0029770349
-
Effect of surface inhomogeneities on the electrical characteristics of SiC schottky contacts
-
Jan.
-
M. Bhatnagar, B. J. Baliga, H. R. Kirk, and G. A. Rozgonyi, "Effect of surface inhomogeneities on the electrical characteristics of SiC schottky contacts," IEEE Trans. Electron Devices, vol. 43, pp. 150-156, Jan. 1996.
-
(1996)
IEEE Trans. Electron Devices
, vol.43
, pp. 150-156
-
-
Bhatnagar, M.1
Baliga, B.J.2
Kirk, H.R.3
Rozgonyi, G.A.4
-
9
-
-
0030379084
-
Reverse-leakage current calculations for SiC schottky contacts
-
Dec.
-
J. Crofton and S. Sriram, "reverse-leakage current calculations for SiC schottky contacts," IEEE Trans. Electron Devices, vol. 43, pp. 2305-2307, Dec. 1996.
-
(1996)
IEEE Trans. Electron Devices
, vol.43
, pp. 2305-2307
-
-
Crofton, J.1
Sriram, S.2
|