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Volumn 24, Issue 7, 2003, Pages 484-486

Ideal rectangular cross-section Si-Fin channel double-gate MOSFETs fabricated using orientation-dependent wet etching

Author keywords

(110) oriented SOI; Double gate MOSFET; FinFET; FXMOSFET; Orientation dependent etching; Short channel effects; XMOS

Indexed keywords

GATES (TRANSISTOR); SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS; TRANSCONDUCTANCE;

EID: 0041886632     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2003.815004     Document Type: Letter
Times cited : (100)

References (9)
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  • 2
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    • Choi, Y.-K.1    King, T.-J.2    Hu, C.3
  • 8
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    • Characterization of surface mobility on the sidewalls of dry-etched trenches
    • C. J. Petti, J. P. McVittie, and J. D. Plummer, "Characterization of surface mobility on the sidewalls of dry-etched trenches," in IEDM Tech. Dig., 1988, pp. 104-107.
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  • 9
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    • Fabrication of 2-nm-wide silicon quantum wires through a combination of a partially-shifted resist pattern and orientation-dependent etching
    • H. Namatsu, K. Kurihara, M. Nagase, and T. Makino, "Fabrication of 2-nm-wide silicon quantum wires through a combination of a partially-shifted resist pattern and orientation-dependent etching," Appl. Phys. Lett., vol. 70, no. 5, pp. 619-621, 1997.
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    • Namatsu, H.1    Kurihara, K.2    Nagase, M.3    Makino, T.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.