Hierarchical placement for power hybrid circuits under reliability & wireability constraints

IEEE Transactions on Reliability

Volumn 45, Issue 2, 1996, Pages 200-207

  Lee, Jing ^a,b   Chou, Jung Hua ^a,b  

^a SOUTHERN TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Placement; Power hybrid circuit; Wireability

Indexed keywords

ALGORITHMS; CONSTRAINT THEORY; GRAPH THEORY; HEAT LOSSES; HYBRID INTEGRATED CIRCUITS; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; OPTIMIZATION; PRINTED CIRCUIT BOARDS; SET THEORY; THERMAL EFFECTS;

PLACEMENT; POWER HYBRID CIRCUITS; WIREABILITY;

RELIABILITY;

EID: 0030168095     PISSN: 00189529     EISSN: None     Source Type: Journal    
DOI: 10.1109/24.510802     Document Type: Article

References (22)

1. P. Lall, M. Pecht, E. Hakim, Characterization of functional relationship between temperature and microelectronic reliability. Microelectronics & Reliability, vol 35, num 3, 1995, pp 377-402.
2. N.B. Lycoudes, C.C. Childers, Semiconductor instability failure mechanisms review, IEEE Trans. Reliability, vol R-29, 1980 Jun, pp 237-248.
3. D.L. Waller, L.R. Fox, R.J. Hannemann, Analysis of surface mount thermal and thermal stress performance, IEEE Trans. Components, Hybrids, and Manufacturing Technology, vol 6, 1983 Sep, pp 257-266.
4. J.R. Sims, P.G. Creter, A.H. Leveille, An approach to computer aided design of multilayer hybrids, Part 1, Solid State Technology, vol 22, 1979 Oct. pp 95-101.
5. J.R. Sims, P.G. Creter, A.H. Leveille, An approach to computer aided design of multilayer hybrids, Part 2, Solid State Technology, vol 22, 1979 Nov, pp 90-96.
6. N.R. Quinn, M.A. Breuer, A force directed component placement procedure for printed circuit boards, IEEE Trans. Circuits and System, vol CAS-26, 1979 Jun, pp 377-388.
7. th Design Automation Conf, 1979, pp 1-10.
8. L. Sha, T. Blank, ATLAS - A technique for layout using analytic shapes, IEEE Int'l Conf. Computer-Aided Design, 1987, pp 84-87.
9. B. Krishnamurthy, An improved min-cut algorithm for partitioning VLSI networks, IEEE Trans. Computer, vol C-33, 1984 May, pp 438-446.
10. C.-K. Cheng, Y.-C. Wei, An improved two-way partitioning algorithm with stable performance, IEEE Trans. Computer-Aided Design, vol 10, 1992 Sep, pp 1074-1085.
11. L.T. Liu, M.T. Kuo, C.K. Cheng, T.C. Hu, A replication cut for two-way partitioning, IEEE Trans. Computer-Aided Design of Integrated Circuits and Systems, vol 14, 1995 May, pp 623-630.
12. th Design Automation Conf, 1982, pp 671-677.
13. M. Maly, A.P. Piotrowski, Heat exchange optimization technique for high-power hybrid IC's, IEEE Trans. Components, Hybrids, and Manufacturing Technology, vol 2, 1979 Jun, pp 226-231.
14. M. Pecht, J. Naft, Thermal reliability management in PCB design, Proc. 1987 Ann. Reliability & Maintainability Symp, 1987, pp 27-29.
15. D. Dancer, M. Pecht, Reliability optimization technique for convec-lively cooled electronics, IEEE Trans. Reliability, vol 38, 1989 Jun, pp 199-205.
16. A.H. Mayer, Computer-aided thermal design of avionics for optimal reliability and minimum life-cycle cost, AFFDL-TR-7848, 1978 Mar.
17. M.D. Osterman, A physics of failure approach to component placement, ASME J. Electronic Packaging, vol 114, 1992 Sep, pp 305-309.
18. R. Eliasi, T. Elperin, A. Bar-Cohen, Monte Carlo thermal optimization of populated printed circuit board, IEEE Trans. Components, Hybrids, and Manufacturing Technology, vol 13, 1990 Dec, pp 953-960.
19. M.D. Osterman, M. Pecht, Placement for reliability and routability of convectively cooled PWB's, IEEE Trans. Computer-Aided Design, vol 9, 1990 Jul, pp 734-744.
20. J. Lee, J.H. Chou, S.L. Fu, Reliability and wireability optimizations for module placement on convectively cooled printed wiring board, INTEGRATION, the VLSI J., vol 18, num 2&3, 1995, pp 173-186.
21. G.N. Ellison, Thermal Computations for Electronic Equipment, 1983; Van Nostrand Reinhold.
22. J. Lee, J.H. Chou, S.L. Fu, Clustering algorithm for network partitioning with a hypergraph model, J. Information Science und Engineering, vol 9, num 3, 1993, pp 1-20.