A Temperature-Aware Simulation Environment for Reliable ULSI Chip Design

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Volumn 19, Issue 10, 2000, Pages 1211-1220

  Cheng, Yi Kan ^a  

^a MOTOROLA INC   (United States)

Author keywords

Circuits; Reliability; Simulation; Temperature; Timing

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; RELIABILITY; SENSITIVITY ANALYSIS; TEMPERATURE; THERMAL DIFFUSION; ULSI CIRCUITS;

TEMPERATURE AWARE SIMULATION; TEMPERATURE SENSITIVE TIMING ANALYSIS;

INTEGRATED CIRCUIT LAYOUT;

EID: 0034294478     PISSN: 02780070     EISSN: None     Source Type: Journal    
DOI: 10.1109/43.875333     Document Type: Article

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