Multiobjective optimal placement of convectively and conductively cooled electronic components on printed wiring boards

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 2, 2000, Pages 152-159

  Queipo, Nestor V ^a   Gil, Guy F ^a  

^a UNIVERSIDAD DEL ZULIA   (Venezuela)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041469124     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.483148     Document Type: Article

References (27)

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