Thermal placement design for MCM applications

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 2, 2000, Pages 115-120

  Huang, Yu Jung ^a   Fu, Shen Li ^a  

^a I SHOU UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000659948     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.483142     Document Type: Article

References (13)

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2. Schaper, L. W., 1992, “Design of Multichip Modules,” Proc. IEEE, 80, No. 12, pp. 1955-1964.
3. Bar-Cohen, A., and Kraus, A. D., 1993, Advances in Thermal Modeling of Electronic Components and Systems, Vol. 3, ASME Press, New York/IEEE Press, New York.
4. Queipo, N. V., Humphrey, A. C., and Ortega, A., 1998, “Multiobjective Optimal Placement of Convectively Cooled Electronic Components on Printed Wiring Boards,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 21, No. 1, pp. 142-153.
5. Sherwani, N. A., 1993, Algorithms for VLSI Physical Design Automation, Kluwer Academic Publishers, Boston, MA, Chap. 5.
6. Lee, J., and Chou, J. H., 1996, “Hierarchical Placement for Power Hybrid Circuits Under Reliability and Wireability Constraints,” IEEE Trans. Reliab., 45, No. 2, pp. 200-207.
7. Lee, J., Chou, J. H., and Fu, S. L., 1995, “Reliability and Wireability Optimizations for Module Placement on Convectively Cooled Printed Wiring Board,” Integration, the VLSI J., 18, No. 3, pp. 173-186.
8. Osterman, M. D., and Pecht, M., 1990, “Placement for Reliability and Routability of Convectively Cooled PWB’s,” IEEE Trans. Comput.-Aided Des., 9, No. 7, pp. 734-744.
9. Quinn, N. R., and Breuer, M. A., 1979, “A Forced Directed Component Placement Procedure for Printed Circuit Boards,” IEEE Trans. Circuits Syst., CAS-26, No. 6, pp. 377-388.
10. Zadeh, L. A., Fu, K. S., Tanaka, K., and Shimura, M., 1975, Fuzzy Sets and Their Applications to Cognitive and Decision Processes, Academic, London.
11. Doane, D. A., and Franzon, P. D., 1993, Mutichip Module Technologies and Alternatives The Basics, Chapter 12, Van Nostrand Reinhold, New York.
12. Hanan, M., and Kurtzberg, J., 1972, “Placement Technique,” Design Automation of Digital Systems: Theory and Techniques, Breuer, M. A., ed., Prentice-Hall, Englewood Cliffs, NJ, Chap. 5.
13. Burnett, D. S., 1987, Finite Element Analysis, Addision-Wesley.