MCM placement using a realistic thermal model

Proceedings of the IEEE Great Lakes Symposium on VLSI

Volumn , Issue , 2000, Pages 189-192

  Beebe, Craig ^a   Carothers, Jo Dale ^a   Ortega, Alfonso ^a  

^a UNIVERSITY OF ARIZONA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; COMPUTER SIMULATION; HEAT LOSSES; ITERATIVE METHODS; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICE MODELS; SIMULATED ANNEALING;

PLACEMENT ALGORITHMS;

MULTICHIP MODULES;

EID: 0033685921     PISSN: 10661395     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/330855.331039     Document Type: Conference Paper

References (14)