Solder joint reliability of a polymer reinforced wafer level package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1347-1354

  Kim, Deok Hoon ^a   Elenius, Peter ^a   Johnson, Michael ^a   Barrett, Scott ^a  

^a Flip Chip Division   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; POLYMERS; PRINTED CIRCUIT BOARDS; REINFORCED PLASTICS; SOLDERED JOINTS; THERMAL CYCLING;

WAFER LEVEL PACKAGE (WLP);

CHIP SCALE PACKAGES;

EID: 0036287235     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00102-6     Document Type: Article

References (12)

1. The ultra CSP wafer level package
2. Reliability characterization in ultra CSP package development
3. A polymer reinforced WLP /why it has superior solder joint reliability
4. Polymer collar - A polymer reinforced wafer level package solder bump
5. External polymer reinforcement of solder ball structure
6. Fab integrated packaging(FIP): A new concept for high reliability wafer-level chip size packaging
7. Deformation and crack growth characteristics of SnAgCu vs 63Sn-Pb solder joints on a WLP in thermal cycle testing
8. Solder joint reliability and characteristics of deformation and crack growth of SnAgCu vs 63Sn/Pb on a WLP in a thermal cycling test
9. Designing best- in-class impact tolerant cellular phones and other portable products
10. Critical aspects of reworkable underfills for portable consumer products