A polymer reinforced WLP / why it has superior solder joint reliability

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4587, Issue , 2001, Pages 78-88

  Kim, Deok Hoon ^a   Elenius, Peter ^a   Barrett, Scott ^a  

^a Flip Chip Division   (United States)

Author keywords

Polymer Collar; Polymer reinforced solder bump; Solder joint reliability; Ultra CSP; Wafer Level CSP; WLP

Indexed keywords

CRACK PROPAGATION; MICROPROCESSOR CHIPS; POLYMERS; RELIABILITY; SHEAR DEFORMATION; SOLDERED JOINTS; THERMAL CYCLING;

POLYMER COLLARS;

CHIP SCALE PACKAGES;

EID: 0035772472     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. th Pan Pacific Microelectronics Symposium, Feb., 1999.
2. th ECTC, Las Vegas, Nevada, May 21-24, 2000.
3. Deok-Hoon Kim, Peter Elenius, and Scott Barrett, "External Polymer Reinforcement of Solder Ball Structure", IMAPS ATW on CSP, September 22-24 2000.
4. Deok-Hoon Kim, Peter Elenius, and Scott Barrett, "Polymer Collar - A Polymer Reinforced Wafer Level Package Solder Bump", IMAPS HDI 2001, April 18-20, 2001.
5. st ECTC, May 29 - June 1, 2001.
6. Kazutaka Shoji /NEC Corporation, "Semiconductor Device", US Patent Number 5,847,456, Dec. 8, 1998.
7. th ECTC, Las Vegas, Nevada, May 21-24, 2000.
8. B. Keser and T. Fang, "Creation of a New Wafer Level Package", IMAPS ATW on CSP, September 22-24, 2000.