Solder joint reliability of a polymer reinforced wafer level package

Microelectronics Reliability

Volumn 42, Issue 12, 2002, Pages 1837-1848

  Kim, Deok Hoon ^a   Elenius, Peter ^a   Johnson, Michael ^a   Barrett, Scott ^a  

^a Flip Chip Division   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; PHOTOLITHOGRAPHY; SILICON WAFERS; SOLDERED JOINTS; SPIN COATING; SPUTTERING; THERMAL CYCLING;

WAFER LEVEL PACKAGES (WLP);

CHIP SCALE PACKAGES;

EID: 0036890567     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00102-6     Document Type: Article

References (12)

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3. Yang H., Elenius P., Barrett S., Schneider C., Leal J., Moraca R., et al. Reliability characterization in Ultra CSP Package Development. IEEE 50th ECTC, Las Vegas, Nevada, 21-24 May 2000.
4. Kim D.-H., Elenius P., Johnson M., Barrett S. Solder joint reliability of a polymer reinforced wafer level package. IEEE 52nd ECTC 2002, San Diego, California, 28-31 May 2002.
5. Kim D.-H., Elenius P., Barrett S. A polymer reinforced WLP/Why it has superior solder joint reliability. IMAPS 2001, The 34th International Symposium on Microelectronics, Baltimore, MA, 9-11 October 2001.
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8. Kim D.-H., Elenius P. Deformation and crack growth characteristics of Sn-Ag-Cu vs 63Sn-Pb solder joints on a WLP in thermal cycle testing. IEEE 51st ECTC, Orlando, Florida, 28-31 May 2001.
9. Kim D.-H., Elenius P., Barrett S. Solder joint reliability and characteristics of deformation and crack growth of Sn-Ag-Cu vs eutectic Sn-Pb on a WLP in a thermal cycling test. IEEE Transaction on Electronics Packaging Manufacturing 2002;25(2).
10. Shoji K. NEC Corporation, "Semiconductor Device", US Patent Number 5,847,456, 8 December 1998.
11. Topper M., Auersperg J., Glaw V., Kaskoun K., Prack E., Keser B., et al. Fab integrated packaging (FIP): a new concept for high reliability wafer-level chip size packaging. IEEE 50th ECTC, Las Vegas, Nevada, 21-24 May 2000.
12. Keser B., Fang T. Creation of a new wafer level package. IMAPS ATW on CSP, 22-24 September 2000.