Effects of microstructure on the creep properties of the lead-free Sn-3.5Ag-Cu solders

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1221-1225

  Joo, D K ^a   Yu, Jin ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COLD ROLLING; COMPUTER SIMULATION; CREEP; FLIP CHIP DEVICES; FRACTOGRAPHY; MICROSTRUCTURE; QUENCHING;

KACHANOV EQUATIONS;

SOLDERING ALLOYS;

EID: 0036287380     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)