Reliability evaluation structures for stacked thin dice packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1197-1202

  Karjalainen, Päivi ^a   Tanskanen, Jarmo ^a   Ristolainen, Eero O ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; INTEGRATED CIRCUITS; MULTICHIP MODULES; RELIABILITY; SOLDERED JOINTS; THERMAL EXPANSION;

STACKED THIN DICE PACKAGING; THERMAL TEST STRUCTURES;

ELECTRONICS PACKAGING;

EID: 0038688836     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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