Design issues of a multi-functional intelligent thermal test die

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2001, Pages 50-57

  Poppe, A ^a,b   Farkas, G ^a   Rencz, M ^a,b   Benedek, Z ^b   Pohl, L ^b   Szekely V ^b   Torki, K ^c   Mir, S ^c   Courtois, B ^c  

^a MicReD Ltd   (Hungary)

^b BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

^c TIMA LABORATORY   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; MOSFET DEVICES; RESISTORS; SENSORS; THERMOANALYSIS;

THERMAL TEST CHIPS;

CHIP SCALE PACKAGES;

EID: 0035010289     PISSN: 10652221     EISSN: None     Source Type: Journal    
DOI: 10.1109/STHERM.2001.915144     Document Type: Article

References (0)