Reliability of different Flex materials in high density flip chip on Flex applications

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

Volumn , Issue , 2001, Pages 224-229

  Palm, Petteri ^a   Määttänen, Jarmo ^a   De Maquillé, Yannick ^b   Picault, Alain ^b   Vanfleteren, Jan ^c   Vandecasteele, Björn ^c  

^a Elcoteq   (Finland)

^b FCI Microelectronics   (France)

^c IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COATING TECHNIQUES; CONDUCTIVE MATERIALS; THERMAL CYCLING;

FLEX MATERIALS;

FLIP CHIP DEVICES;

EID: 0035790685     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Palm P., The development and reliability if flip chip technology in electronics module manufacturing, Ph.D. thesis, TUT, Tampere, Finland, 2001.
2. Määttänen, J., Anisotropic adhesive interconnection: An alternative for solder joints in high density electrical contacts, Ph.D. thesis, TUT, Tampere, Finland, 2001.
3. Määttänen J., Palm P., Tuominen A., Ristolainen E., Conductivity model for metal-coated polymer particles used in anisotropically conductive adhesives, 2001 ICEP conference, April 18-20, Tokyo, Japan, 2001.
4. Watanabe I., Takemura K., Anisotropic Conductive Adhesive Films for Flip Chip interconnection, Conductive Adhesives for Electronics Packaging, Edited by Liu, J., Electrochemical Publications Ltd., 1999.
5. Holloway M., Crane L, Peters S., A Roadmap to Flip Chip Assembly using Advanced Adhesives, VTE Aufbau und Verbindungs Technik in der Elektronik, No.5, Oct 1999, p.81-85, June 1, Strasbourg, France, 2001.
6. Sheldahl, Materials for Flexible Circuits, Printed Circuits Handbook, edit. Clyde F. Coombs, Jr., Fourth edition, chap. 40, McGraw-Hill, New York, 1996.
7. th European Microelectronics and Packaging conference, IMAPS, May 30
8. Sheldahl, Design of Flexible Circuits, Printed Circuits Handbook, edit. Clyde F. Coombs, Jr., Fourth edition, chap 41, McGraw-Hill, New York, 1996.
9. Robert A. F., Advanced materials technology, Printed Circuits Handbook, Fourth edition, chap 9, edit. Coombs, C.F. Jr., McGraw-Hill, New York, 1996.
10. Mahesh G.V., Bousted K., Brox, B., Flexible circuit technology -an overview, IVF report 95015.