Analysis and measurement of thermal resistance in a 3-dimensional silicon multichip module populated with assembly test chips

Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1993, Pages 1-7

  Sweet, James N ^a   Peterson, David W ^a   Chu, Dahwey ^a   Bainbridge, Bruce L ^a   Gassman, Richard A ^a   Reber, Cathy A ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; FINITE ELEMENT METHOD; HEAT RESISTANCE; HEAT TRANSFER; TEMPERATURE DISTRIBUTION; TEMPERATURE MEASUREMENT; THERMOANALYSIS;

MCM THERMAL MANAGEMENT; MULTICHIP MODULES; THREE-DIMENSIONAL MULTICHIP;

ELECTRONICS PACKAGING;

EID: 0027136243     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)