Adhesion, passivation, and resistivity of a Ag(Mg) gate electrode for an amorphous silicon thin-film transistor

Journal of Materials Research

Volumn 18, Issue 6, 2003, Pages 1441-1446

  Lee, Jaegab ^a   Yang, Heejung ^a   Lee, Jinhyung ^a   Shin, Hyunjung ^a   Kim, Jiyoung ^a   Jeong, Changoh ^b   Cho, Beomseok ^b   Chung, Kyuha ^b   Lee, Eungu ^c  

^a Kookmin University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

^c Chosun University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AMORPHOUS SILICON; ANNEALING; ELECTRIC CONDUCTIVITY; ELECTRODES; GATES (TRANSISTOR); MULTILAYERS; PASSIVATION; PLASMA APPLICATIONS; SILVER ALLOYS; SOLUBILITY; SPUTTER DEPOSITION; TRANSMISSION ELECTRON MICROSCOPY;

ALLOY FILMS;

THIN FILM TRANSISTORS;

EID: 0038676538     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2003.0198     Document Type: Article

References (14)

1. Y. Wang and T. L. Alford, Appl. Phys. Lett. 74, 52 (1999).
2. P. Nguyen, Y. Zeng, and T.L. Alford, J. Vac. Sci. Technol. B 19, 158 (2001).
3. C.O. Jeong, N.S. Roh, S.G. Kim, H.S. Park, C.W. Kim, D.S. Sakong, J.H. Seok, K.H. Chung, W.H. Lee, D. Gan, P.S. Ho, B.S. Cho, B.J. Kang, H.J. Yang, Y.K. Ko, and J.G. Lee, J. Electron Mater. 31, 610 (2002).
4. M. Hauder, J. Gstottner, W. Hansch, and D. Schmitt-Landsiedel, Appl. Phys. Lett. 78, 838 (2001).
5. E. Kondoh and T. Asano, Proc. of Advanced Metallization Conference 1999, edited by M.E. Gross, T. Gessner, N. Kobayashi, and Y. Yasuda (MRS, Warrendale, PA, 2000), p. 219.
6. S.J. Hong, H.J. Yang, J.Y. Kim, H.J. Shin, J.H. Lee, Y.K. Ko, J.G. Lee, B.J. Kang, B.S. Cho, C.O. Jeong, K.H. Cung, and C. M. Lee, J. Kor. Phys. Soc. 41, 417 (2002).
7. S.K. Sharma and J. Spitz, Thin Solid Films 65, 339 (1980).
8. W. Lee, H. Cho, B. Cho, J. Kim, Y. Kim, W-G. Jung, H. Kwon, J. Lee, C. Lee, P.J. Reucroft, and J. Lee, J. Vac. Sci. Technol. A 18, 2972 (2000).
9. W. Lee, H. Cho, B. Cho, J. Kim, Y-S. Kim, W-G. Jung, H. Kwon, J. Lee, P.J. Reucroft, C. Lee, and J. Lee, J. Electrochem. Soc. 147, 3066 (2000).
10. W.H. Lee, H.L. Cho, B.S. Cho, J.Y. Kim, W.J. Nam, Y-S. Kim, W.G. Jung, H. Kwon, J.H. Lee, J.G. Lee, P.J. Reucroft, C.M. Lee. and E.G. Lee, Appl. Phys. Lett. 77, 2192 (2000).
11. W.A. Lanford, P.J. Ding, W. Wang, S. Hymes, and S.P. Muraka, Thin Solid Films 262, 234 (1995).
12. P.J. Ding, W.A. Lanford, S. Hymes, and S.P. Murarka, Appl. Phys. Lett. 64, 2897 (1994).
13. C.O. Muller, Corrosion (Houston) 47, 146 (1991).
14. K.S. Cadre and T.L. Alford, J. Vac. Sci. Technol. B 18, 2814 (2000).