Factors affecting passivation of Cu(Mg) alloy films

Journal of the Electrochemical Society

Volumn 147, Issue 8, 2000, Pages 3066-3069

  Lee, Wonhee ^a   Cho, Heunglyul ^a   Cho, Bumseok ^a   Kim, Jioung ^a   Kim, Yong Suk ^a   Jung, Woo Gwang ^a   Kwon, Hoon ^a   Lee, Jinhyung ^a   Reucroft, P J ^b   Lee, Chongmu ^c   Lee, Jaegab ^a  

^a Kookmin University   (South Korea)

^b UNIVERSITY OF KENTUCKY   (United States)

^c Inha University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER ALLOYS; ELECTRIC CONDUCTIVITY OF SOLIDS; METALLIZING; PASSIVATION; SPUTTER DEPOSITION; VACUUM APPLICATIONS;

ALLOY FILMS; VACUUM PREANNEALING METHODS;

CONDUCTIVE FILMS;

EID: 0034250062     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1393855     Document Type: Article

References (19)

1. N. Awaya and Y. Arita, J. Electron. Mater., 21, 959 (1992).
2. A. Jain, T. T. Kodas, R. Jairath, and M. J. Hampden-Smith, J. Vac. Sci. Technol., B11, 2107 (1993).
3. J. Lin and M. C. Chen, Jpn. J. Appl. Phys., 38, 4863 (1999).
4. S. P. Murarka and S. Hymes, Solid State Mater. Sci., 20, 87 (1995).
5. Y. J. Park, V. K. Andleigh, and C. V. Thompson, J. Appl. Phys., 85, 3546 (1999).
6. C. Whitman, M. M. Moslehi, A. Paranjpe, L. Velo, and T. Omstead, J. Vac. Sci. Technol., A17, 1893 (1999).
7. R. Liu, C. S. Pai, and E. Martinez, Solid-State Electron, 43, 1003 (1999).
8. X. W. Lin and D. Pramanlk, Solid State Technol., p. 63 (Oct 1998).
9. P. J. Ding, W. Wang, W. A. Lanford, S. Hymes, and S. P. Murarka, Appl. Phys. Lett., 65, 1778 (1994).
10. H. Itow, Y. Nakasaki, G. Minamihaba, K. Suguro, and H. Okano, Appl. Phys. Lett., 63, 934 (1993).
11. W. A. Lanford, P. J. Ding, W. Wang, S. Hymes, and S. P. Murarka, Thin Solid Films, 262, 234 (1995).
12. P. J. Ding, W. A. Lanford, S. Hymes, and S. P. Murarka, J. Appl. Phys., 74, 1331 (1993).
13. S. Hymes, S. P. Murarka, S. Shepard, and W. A. Lanford, J. Appl. Phys., 71, 4623 (1992).
14. J. Li, J. W. Mayer, and E. G. Colgan, J. Appl. Phys., 70, 2820 (1991).
15. P. J. Ding, W. A. Lanford, S. Hymes, and S. P. Murarka, J. Appl. Phys., 75, 3627 (1994).
16. P. J. Ding, W. A. Lanford, S. Hymes, and S. P. Murarka, Appl. Phys. Lett., 64, 2897 (1994).
17. C. Cabral, J. M. Harper, K. Holloway, D. A. Smith, and R. G. Schad, J. Vac. Sci. Technol., A10, 1706 (1992).
18. T. B. Massalski, Binary Alloy Phase Diagram, p. 2703, The Materials Information Society, Materials Park, OH (1990).
19. H. L. Cho and J. G. Lee, in Advanced Interconnects and Contacts, p. 353, Materials Research Society, San Francisco, CA (1999).