Tensile Properties and Plane-Stress Fracture Toughness of Thin Film Aerospace Adhesives

Journal of Adhesion

Volumn 66, Issue 1-4, 1998, Pages 251-273

  Butkus, L M ^a   Mathern, P D ^a   Johnson, W S ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

Author keywords

Adhesives; Bonded joints; Environmental exposure; Epoxy; Fracture toughness; Polyimide; Scrim (carrier) cloth; Tensile test

Indexed keywords

ADHESIVE JOINTS; AEROSPACE APPLICATIONS; EPOXY RESINS; FRACTURE TOUGHNESS; PLASTIC SHEETS; POLYIMIDES; TENSILE STRENGTH; TENSILE TESTING; THERMAL CYCLING; THIN FILMS;

AEROSPACE ADHESIVES;

PLASTIC ADHESIVES;

EID: 0031676903     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218469808009968     Document Type: Article

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