Resin flow characteristics of underfill encapsulant for flip-chip interconnection

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 1, 2003, Pages 268-274

  Yamada, Hiroshi ^a   Togasaki, Takashi ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

Area array bump design; Bump pitch; Flip chip interconnection; Flow characteristics; Newtonian laminar flow; Peripheral bump design; Stand off height; Underfill encapsulant; Uniform encapsulation; Void free encapsulation

Indexed keywords

ENCAPSULATION; FLIP CHIP DEVICES; LAMINAR FLOW; LSI CIRCUITS; NEWTONIAN FLOW; PLASTIC FLOW; RELIABILITY; RESINS; SUBSTRATES; VIDEO CAMERAS;

AREA ARRAY BUMP DESIGN; FLIP CHIP INTERCONNECTION; NEWTONIAN LAMINAR FLOW MODEL; RESIN FLOW; UNDERFILL ENCAPSULANT;

ELECTRONICS PACKAGING;

EID: 0038142329     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.806182     Document Type: Article

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