Development of the wafer level compressive-flow underfill process and its involved materials

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 4, 1999, Pages 274-281

  Shi, Songhua ^a,b   Yamashita, T ^b   Wong, C P ^a,b  

^a IEEE

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONTACTS; EPOXY RESINS; FLIP CHIP DEVICES; FLUXES; PRINTED CIRCUIT BOARDS; RHEOMETERS; SOLDERED JOINTS; THERMAL EXPANSION; THERMOGRAVIMETRIC ANALYSIS; VISCOSITY;

DYNAMIC-MECHANICAL ANALYZERS (DMA); SOLDER REFLOW PROCESS; THERMOMECHANICAL ANALYZERS (TMA); WAFER-LEVEL COMPRESSIVE FLOW UNDERFILL (WLCFU) MATERIALS;

ELECTRONICS PACKAGING;

EID: 0033356402     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.816094     Document Type: Article

References (11)

1. R. Marrs, "Trends in IC packaging," Electron. Packag. Prod., pp. 24-30, Aug. 1996.
2. R. R. Tummala, E. J. Rymaszewski, and A. Klopfenstein, Microelectronics Packaging Handbook, Part II, 2nd ed. New York: Chapman & Hall, 1997.
3. F. Nakano, T. Soga, and S. Amagi, "Resin-insertion effect on thermal cycle resistivity of flip-chip mounted LSI devices," in Proc. Int. Soc. Hybrid Microelectron. Conf. '87, 1987, p. 536.
4. D. Suryanarayana, R. Hsiao, T. P. Gall, and J. M. McCreary, "Flip-chip solder bump fatigue life enhanced by polymer encapsulation," in Proc. 40th IEEE Electron. Comp. Technol. Conf. '90, 1990, p. 338.
5. D. Suryanarayana and D. S. Farquhar, "Underfill encapsulant for flip chip applications," in Chip on Board, J. H. Lau, Ed. New York: Van Nostrand Reinhold, 1994, pp. 504-531.
6. L. Nguyen et al., "High performance underfills development-Materials, process, and reliability," in Proc. PEP '97, 1997, p. 300.
7. C. P. Wong and D. F. Baldwin, "No-flow underfill for flip-chip packages," U.S. Patent pending, Apr. 1996.
8. C. P. Wong, D. F. Baldwin, M. B. Vincent, B. Fennell, L. J. Wang, and S. H. Shi, "Characterization of a no-flow underfill encapsulant during the solder reflow process," in Proc. 48th Electron. Comp. Technol. Conf. '98, 1998, p. 1253.
9. S. H. Shi and C. P. Wong, "Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications," in Proc. 48th Electron. Comp. Technol. Conf. '98, 1998, p. 117.
10. C. P. Wong, S. H. Shi, and G. Jefferson, "High performance no-flow underfills for low-cost flip-chip applications: Material characterization," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 21, pp. 450-458, Sept. 1998.
11. A. V. Tobolsky, Properties and Structure of Polymers. New York: Wiley, 1960.