Manufacturability Issues in Flip Chip on Laminate Assembly

International Journal of Microcircuits and Electronic Packaging

Volumn 22, Issue 3, 1999, Pages 270-278

  Qi, Jing ^a   Wayne Johnson, R ^a   Yaeger, Erin ^b   Konarski, Mark ^b   Doody, Todd ^b   Szczepaniak, Z Andrew ^b   Crane, Larry ^b  

^a AUBURN UNIVERSITY   (United States)

^b Loctite Corp   (United States)

Author keywords

Flip Chip; Manufacturing; Reliability; Underfill

Indexed keywords

EID: 0001766228     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. N. W. Pascarella and D. F. Baldwin, "Cost Analysis for Low Cost High Throughput Next Generation Flip Chip Assembly," International Journal of Microcircuits & Electronic Packaging, IJMEP, Vol. 20, No. 4, pp. 571-577, 1997.
2. R. Wayne Johnson, M. Albert Capote, Z. Ming Zhou, Sherry Chu, and Ligui Zhou, "Reflow-Curable Polymer Fluxes for Flip Chip Assembly," Proceedings of Surface Mount International Technical Program, San Jose, California, September 7-11, pp. 267-272, 1997.
3. Lawrence P. McGovern and Daniel F. Baldwin, "Initial Development Work on a High Throughput Low Cost Flip Chip on Board Assembly Process," Proceedings of the 1997 International Symposium on Microelectronics, ISHM'97, Philadelphia, Pennsylvania, October 14-16, pp. 579-585, 1997.
4. D. R. Gamota and C. M. Melton, "Materials to Integrate the Solder Reflow and Underfill Encapsulation Processes for Flip Chip on Board Assembly," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C: Manufacturing, Vol. 21, No. 1, pp. 57-65, 1998.
5. Nathan W. Pascarella and Daniel F. Baldwin, "Compression Flow Modeling of Underfill Encapsulants for Low Cost Flip Chip Assembly," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C: Manufacturing, Vol. 21, No. 4, pp. 325-335, 1998.
6. John A. Emerson and Carol L. Jones Adkins, "The Tools You Need for Development and Production When Using Underfill Materials," Proceedings of the 1998 SMI Conference, San Jose, California, August 23-27, pp. 270-274, 1998.
7. James M. Rosson, Robert A. Clawson and David W. Ihms, "Flip Chip Underfill Characterization Methods: Developing a Test Methodology for Success in the Harsh Automotive Environment," Proceedings of the 1998 SMI Conference, San Jose, California, August 23-27, pp. 295-302, 1998.