Effect of hydrogen remote plasma annealing on the characteristics of copper film

Thin Solid Films

Volumn 429, Issue 1-2, 2003, Pages 255-260

  Choi, Kyeong Keun ^a   Yun, Jong Ho ^b   Rhee, Shi Woo ^b  

^a Hynix Semiconductor Inc   (South Korea)

^b Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

Cu reflow; Hydrogen remote plasma annealing

Indexed keywords

ANNEALING; COPPER; HYDROGEN; PLASMAS; SURFACE PROPERTIES;

REMOTE PLASMAS;

THIN FILMS;

EID: 0037960163     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(03)00042-7     Document Type: Article

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