|
Volumn 612, Issue , 2000, Pages
|
Studies of copper surfaces modified by thermal and plasma treatments
|
Author keywords
[No Author keywords available]
|
Indexed keywords
ANNEALING;
COPPER;
ELLIPSOMETRY;
INTEGRATED CIRCUIT LAYOUT;
METALLIC FILMS;
PASSIVATION;
PLASMA APPLICATIONS;
PLASMA TREATMENTS;
SURFACE PHENOMENA;
|
EID: 0034431093
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-612-d9.17.1 Document Type: Conference Paper |
Times cited : (5)
|
References (4)
|