Modeling high power magnetron copper seed deposition: Effect of feature geometry on coverage

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 21, Issue 3, 2003, Pages 596-606

  Stout, Philip J ^a   Zhang, Da ^a   Ventzek, Peter L G ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARGON; ASPECT RATIO; CALCULATIONS; IONIZATION; MAGNETRON SPUTTERING; MATHEMATICAL MODELS; MOLECULAR DYNAMICS; MONTE CARLO METHODS; SPUTTER DEPOSITION;

HIGH POWER MAGNETRON; HYBRID PLASMA EQUIPMENT MODEL; SIDE WALL ANGLE;

COPPER;

EID: 0037937273     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1562178     Document Type: Article

References (10)

1. J. Fu, P. Ding, F. Dorleans, Z. Xu, and F. Chen, J. Vac. Sci. Technol. A 17, 2830 (1999).
2. E. Shidoji, K. Ness, and T. Makabe, Vacuum 60, 299 (2001).
3. O. Yamazaki, K. Iyanagi, S. Takagi, and K. Nanbu, Jpn. J. Appl. Phys., Part 1 41, 1230 (2002).
4. D. Zhang, P. J. Stout, and P. L. G. Ventzek, J. Vac. Sci. Technol. A 21, 265 (2003).
5. P. J. Stout, D. Zhang, S. Rauf, and P. L. G. Ventzek, J. Vac. Sci. Technol. B 20, 2421 (2002).
6. M. Grapperhaus, Z. Krivokapic, and M. J. Kushner, J. Appl. Phys. 83, 35 (1998).
7. J. Lu and M. J. Kushner, J. Vac. Sci. Technol. A 19, 2652 (2001).
8. V. Arunachalam, S. Rauf, D. G. Coronell, and P. L. G. Ventzek, J. Appl. Phys. 90, 64 (2001).
9. J. D. Kress, D. E. Hanson, A. F. Voter, C. L. Liu, X.-Y. Liu, and D. G. Coronell, J. Vac. Sci. Technol. A 17, 2819 (1999).
10. M. Nastasi, J. W. Mayer, and J. K. Hirvonen, Ion-Solid Interactions: Fundamentals and Applications (Cambridge University Press, Cambridge, UK, 1996), Chap. 9.