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Volumn 19, Issue 5, 2001, Pages 2652-2663
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Trench filling by ionized metal physical vapour deposition
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Author keywords
[No Author keywords available]
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Indexed keywords
ANGLE MEASUREMENT;
ANISOTROPY;
ASPECT RATIO;
INDUCTIVELY COUPLED PLASMA;
INTEGRATED CIRCUIT MANUFACTURE;
IONIZATION;
IONS;
MAGNETRON SPUTTERING;
PHYSICAL VAPOR DEPOSITION;
TRENCH FILLING;
PLASMA DEVICES;
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EID: 0035441825
PISSN: 07342101
EISSN: None
Source Type: Journal
DOI: 10.1116/1.1399318 Document Type: Article |
Times cited : (62)
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References (21)
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