Plasma and process characterization of high power magnetron physical vapor deposition with integrated plasma equipment - feature profile model

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 21, Issue 1, 2003, Pages 265-273

  Zhang, Da ^a   Stout, Phillip J ^a   Ventzek, Peter L G ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARGON; COMPUTER SIMULATION; COPPER; DENSITY (SPECIFIC GRAVITY); ELECTRONS; INTEGRATED CIRCUIT MANUFACTURE; IONIZATION; KINETIC THEORY; MONTE CARLO METHODS; PLASMA DEVICES; POSITIVE IONS; SPUTTERING;

ATHERMAL METALS; HIGH POWER MAGNETRON PHYSICAL VAPOR DEPOSITION; HYBRID PLASMA EQUIPMENT MODEL; PLASMA IONIZATION; PLASMA KINETICS; THREE-DIMENSIONAL MONTE CARLO SPUTTERING; TWO-DIMENSIONAL FLUID MODEL;

VAPOR DEPOSITION;

EID: 0037263368     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1531134     Document Type: Article

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