Comparing ionized physical vapor deposition and high power magnetron copper seed deposition

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 20, Issue 6, 2002, Pages 2421-2432

  Stout, P J ^a   Zhang, D ^a   Rauf, S ^a   Ventzek, P L G ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; IONS; MAGNETRONS; NUMERICAL METHODS; SURFACES;

COPPER SEED DEPOSITION; HIGH POWER MAGNETRON; IONIZED PHYSICAL VAPOR DEPOSITION; METAL FLUX;

PHYSICAL VAPOR DEPOSITION;

EID: 0036883112     PISSN: 0734211X     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1525812     Document Type: Article

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