Mechanical characterization of micro/nanoscale structures for MEMS/NEMS applications using nanoindentation techniques

Ultramicroscopy

Volumn 97, Issue 1-4, 2003, Pages 481-494

  Li, Xiaodong ^a   Bhushan, Bharat ^a   Takashima, Kazuki ^b   Baek, Chang Wook ^c   Kim, Yong Kweon ^c  

^a Ohio State University   (United States)

^b TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^c Seoul National University   (South Korea)

Author keywords

Au films; Mechanical properties; Micro nanoscale beams; Ni P films; Polysilicon films; SiC films; SiO2 films

Indexed keywords

BRITTLE FRACTURE; COMPUTER SIMULATION; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; HARDNESS; INDENTATION; NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; PLASTIC DEFORMATION; POLYSILICON; SEMICONDUCTOR DOPING; STRESS CONCENTRATION; THIN FILMS;

NANOELECTROMECHANICAL (NEMS) DEVICES; NANOINDENTATION;

MICROELECTROMECHANICAL DEVICES;

GOLD; NICKEL; PHOSPHORUS; SILICON CARBIDE; SILICON DIOXIDE;

ARTICLE; CHEMICAL STRUCTURE; CRYSTAL; CRYSTAL STRUCTURE; FILM; HARDNESS; MECHANICAL STRESS; MOLECULAR MECHANICS; NANOTECHNOLOGY; SURFACE PROPERTY; YOUNG MODULUS;

EID: 0037865564     PISSN: 03043991     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0304-3991(03)00077-9     Document Type: Article

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