Enhanced Tungsten Chemical Mechanical Polishing Using Stable Alumina Slurries

Electrochemical and Solid-State Letters

Volumn 2, Issue 3, 1999, Pages 148-150

  Bielmann, M ^a   Mahajan, U ^a   Singh, R K ^a   Shah, D O ^a,b   Palla, B J ^a,b  

^a UNIVERSITY OF FLORIDA   (United States)

^b University of Florida   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINA; INTEGRATED CIRCUIT MANUFACTURE; PARTICLES (PARTICULATE MATTER); SILICA; SLURRIES; SURFACE ACTIVE AGENTS; SURFACE ROUGHNESS; TUNGSTEN;

CHEMICAL MECHANICAL POLISHING (CMP);

CHEMICAL POLISHING;

EID: 0033101910     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1390765     Document Type: Article

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