Damage mechanics based fatigue life prediction for 63sn-37pb solder material

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 2000-AG, Issue , 2000, Pages 161-165

  Wei, Y ^a   Chow, C L ^a   Neilsen, M K ^b   Fang, H E ^b  

^a University of Michigan Dearborn   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; FATIGUE DAMAGE; FORECASTING; TIN ALLOYS;

63SN37PB; CYCLIC SOFTENING; DAMAGE-MECHANICS; FATIGUE DAMAGE ACCUMULATION; FATIGUE DAMAGE MODELS; FATIGUE LIFE PREDICTION; SOFTENING BEHAVIOR; SOLDER MATERIAL; STRAIN RANGES; VISCOPLASTIC-DAMAGE MODELS;

LEAD ALLOYS;

EID: 0037593829     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2000-2266     Document Type: Conference Paper

References (16)

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